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Infrared Applications

For bonded wafers.
Quality control of MEMS.
Metrology applications for CD and overlay measurement.

  • Silicon becomes transparent at wavelengths above 900 nm.
  • Transmitted light microscopy in NIR allows to "see through" the silicon as if it was glass.
  • Buried structures, i.e. seal glass, still can be observed.
  • Highly donated areas as well as metal layers show excellent contrast against pure silicon.
  • Measurement and observation tasks can perfectly be carried out using infrared light, such as Critical Distance and Overlay measurement, TSV (Through-Silicon Vias), Alignment Mark Checks.
  • Economy solutions based on silicon-based cameras and transmitted light for low donated silicon.
  • High-end solutions using InGaAs cameras and reflected light for demanding inspection tasks.
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