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High-end fully automated optical inspection (AOI) system for front and back side
Best-in-class sensitivity and throughput allow for lowest COO in industry
Integrated optical review and metrology functions

Key Features

  • Full wafer inspection of patterned and bare wafers, ‎‎edge and back side
  • High throughput and high sensitivity at the same time
  • Detection capability from 1 µm to wafer scale defects
  • Easy-to-write recipes
  • 100% surface, ROI and single/partial die inspection
  • Advanced metrology package for Advanced Packaging
  • Highly modular system, teams with WOTAN and THOR options

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